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The purpose of this paper is to study thermal stability, curing kinetics and physico‐chemical properties of polyurethanes systems for application in in‐mould decoration (IMD) ink.

The thermal stability of three Polyurethane (Pu) systems A, B, C were evaluated by thermogravimetric analysis (TGA). The kinetic parameters of the curing reaction of Pu system C were calculated using non‐isothermal curing kinetics analysis, including the activation energy Ea, the reaction rate constant K(T), the reaction order n, the initial curing temperature (Ti), the peak temperature (Tp), and the finishing temperature (Tf). Additionally, physico‐chemical properties were also evaluated such as flexibility, impact resistance, pencil hardness, adhesive attraction and solvent resistance.

TGA showed that thermal decomposition temperature T5 (5 wt.% weight loss), T10 (10 wt.% weight loss) and Tend (decomposition termination temperature) of Pu system C was 344°C, 363°C, and 489°C, respectively. T5, T10, Tend increased by 77°C, 61°C, 4°C, respectively, and the char yield at 600°C increased by 25.1 wt.% comparing with Pu system B. Curing kinetics analysis showed that Ea of Pu system C was 62.29 KJ/mol, 65.98 KJ/mol and 65.95 KJ/mol by Kissinger, Flynn‐Wall‐Ozawa and Ozawa method, respectively. The order of the curing reaction (n=0.90) demonstrated that it was a complex reaction. Moreover, Pu system C exhibited good physico‐chemical properties. The results showed that Pu system C was suitable to apply into IMD ink.

The TGA analysis, curing kinetics analysis and evaluation of physico‐chemical properties provided a simple and practical solution to study suitable resins for IMD ink application.

IMD ink for heat transfer printing technology is highly efficient, relatively low cost, clean and environmentally safe. It has been widely applied into medical and pharmaceutical products, electronic devices, telecommunication equipment, computer parts, appliance panels, automotive parts, etc.

In this paper, the thermal stability and curing kinetics of Pu for IMD ink are reported for the first time. The paper gives very interesting and important information about thermal stability, curing kinetics and properties of Pu coating system for IMD ink application.

The purpose of this paper is to modify light hollow polymer microsphere (LHPM) with titanium dioxide nanoparticles (nano-TiO2) to improve its compatibility with latex and apply the obtained nano-TiO2/LHPM composite particles in external wall thermal insulation coatings.

The nano-TiO2/LHPM composite particles were prepared via vigorous stirring. The morphology and chemical composition of the produced nano-TiO2/LHPM composite particles were characterized using scanning electron microscopy, energy dispersion spectrum, thermo-gravimetric analyzer and Fourier transform infrared. The performance of this new composite coating was evaluated by checking its stability, density, radiation reflectivity, thermal conductivity and the resulting insulation temperature difference when forming coating film.

It was found that a 9:1 mass ratio of nano-TiO2/LHPM with total 10 weight per cent composite particles in the thermal insulation paint showed low density, good stability, low thermal conductivity (0.1687 W/m·K) and high insulation temperature difference (5.8°C).

The LHPM can be modified by other nanoparticles to improve its insulation performance in thermal insulation coatings.

This work provides a simple, robust, but effective approach to produce new thermal insulation coatings with nano-TiO2/LHPM composite particles.

This method for surface modification of LHPMs is novel and the modified hollow polymer microspheres could be applied to external wall insulation coatings.